Typical application

Vacuum Packaging Bag Circuit Board Antistatic Packaging

Vacuum Packaging of Electronic Components

Thermal shrinkage packaging of bearings, etc.

Pallets for shallow pallet packing, covering, etc.

High Barrier Membrane with PA and EVOH as Core Material-Eleven-Layer Coextrusion Casting Membrane

Thin film structure:

PA/TIE/PP/TIE/PA/EVOH/PA/TIE/PE/PE

High oxygen barrier

Excellent heat sealing performance

Good water vapor barrier performance

High gloss, transparent, printable

(Asymmetric structure, outer PA surface)